Applied

Nov 1994 to Aug 1996
Sector:
FMCG silicon chip processing machines for computer components (Integrated Circuits) mass production.
Overview: 
Mechanical Design – Factory Machinery. Machines incorporating a high vacuum particle physics process to manufacture semi-conductor ‘wafer’ discs – the raw material used for integrated circuits at the heart of computer processor chips. 
Customer ‘special requirements’ designs in 3D on Computervision CADDS 5 for adapting the standardised machine to suit customer’s specific needs. E.g. To use stainless steel tube for gases instead of nylon tube
Magazine article. The image shows the chamber size for the machine and is during manufacture, because the chamber is never accessed by the useron a finished machine.
Worked with:
1/ Specific requirements adaptations with 3D CAD.
2/ Specialised test rig for wafer handling chamber equipment.
3/ Specialised Lifting apparatus and simple calcs.
4/ Form-Fit-Function methods for BoM configuration control / change control, and parts purchasing using ManMan stock control MRP software.
5/ 3D CAD models & detail drawings using EDM and formtek packages working in a ‘form-fit-function’ drawing environment.
6/ Offered permanent employment.
The chamber is shown in this CAD image as pale blue wire frame lines. The red item is the manual interface to load the wafer disks.
Drawn overview of customer specific modifications requirements.
This is a test bed for a low volume chamber and is a much smaller version of the red chamber shown on another image. Low volume takes less time to draw the vacuum, and thus increases throughput. for loading the wafer disks.
Plastic pipework for liquids and gases.
Certificate for completing a Computervision CADDS 5 course.
The Design Environemt of CADDS 5
The components 'tree' environment of CADDS 5
A finished Machine.
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